a doc. no : qw0905- rev. : date : - 2007 26 - mar. LSBK2640S data sheet LSBK2640S round type led lamps pb lead-free parts ligitek electronics co.,ltd. property of ligitek only
-30 directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 100%75% -60 25% 25% 50% 0 75% 50%100% 60 0 30 package dimensions part no. LSBK2640S page ligitek electronics co.,ltd. property of ligitek only 1/5 0.5 typ 25.0min 2.54typ 1.0min 3.3 4.3 1.5max 2.9 3.1 + -
typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. emitted LSBK2640S ingan/sic blue part no material blue diffused 475 4.2 263.5120220 spectral halfwidth nm lens color dominant wave length dnm forward voltage @20ma(v) max. typ. luminous intensity @20ma(mcd) min. typ. 50 viewing angle 2 1/2 (deg) page 2/5 unit ligitek electronics co.,ltd. property of ligitek only peak forward current duty 1/10@10khz i fp 100 storage temperature power dissipation reverse current @5v electrostatic discharge( * ) operating temperature tstg -30 ~ +100 ir t opr esd pd 50 -20 ~ +80 500 120 absolute maximum ratings at ta=25 parameter forward current symbol i f 30 sbks ratings a v mw ma ma * static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. LSBK2640S part no.
25 ambient temperature( ) fig.3 forward current vs. temperature 0 f o r w a r d c u r r e n t @ 2 0 m a 0 10 20 40 30 680 630 530 430 480 480 0 380 580 r e l a t i v e i n t e n s i t y @ 2 0 m a 100 50 75 wavelength (nm) fig.4 relative intensity vs. wavelength 0.5 1.0 2 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve f o r w a r d c u r r e n t ( m a ) 1 0 5 10 15 30 25 20 sbk-s chip 1.0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a forward current(ma) 5 4 3 05 forward voltage(v) 0 0.25 0.75 0.5 30 25 15 1020 fig.2 relative intensity vs. forward current 1.5 1.25 ligitek electronics co.,ltd. property of ligitek only page3/5 LSBK2640S part no.
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 4/5 0 preheat 0 25 2 /sec max 100 50 150 time(sec) temp( c) 120 260 5 /sec max 260 c3sec max 60 seconds max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. LSBK2640S part no.
ligitek electronics co.,ltd. property of ligitek only reference standard jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. operating life test low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. page 5/5 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. high temperature high humidity test thermal shock test this test intended to see soldering well performed or not. 1.t.sol=230 5 2.dwell time=5 1sec solderability test 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. LSBK2640S part no.
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